Skip to main content

Table 2 Bond strength of metal-resin specimens with or without epoxy monolith mediator

From: Metal-resin bonding mediated by epoxy monolith layer

Resin

Bond strength based on apparent adhesion area (100 mm2) (MPa)

Imaginary bond strength based on pore cross-section area (MPa)

Breaking strain for SUS-resin specimen (%)

Modulus for SUS-resin specimen (GPa)

Modulus for resin plates (GPa)

Via epoxy monolith

Via flat epoxy

Direct bonding

PE

2.00 ± 0.22

~0

0.63 ± 0.21

28.2 ± 5.5

2.3 ± 0.6

0.4 ± 0.1

0.7

PEa

2.20 ± 0.31

~0

0.63 ± 0.21

1.6 ± 0.5

0.4 ± 0.02

0.7

PP

1.36 ± 0.20

~0

0.85

12.6 ± 3.4

1.2 ± 0.4

0.4 ± 0.1

0.9

POM

1.22 ± 0.57

~0

0.52

17.0 ± 6.4

0.9 ± 0.4

0.8 ± 0.3

1.3

ABS

2.66 ± 0.74

~0

0.08

35.3 ± 20.6

1.4 ± 0.5

0.8 ± 0.1

1.0

  1. a Epoxy with a connected-globule structure was used instead of epoxy monolith with a bicontinuous structure