Influence of the composition of different resin composites in the Knoop hardness and bond strength between tooth/restoration

Applied Adhesion Science

Table 1 Description of the materials used according to the manufacturer - 3 M/ESPE

Resin composite	Adhesive system used	Organic matrix	Filler content – Wt% - Average size
Z100	Adper Single Bond2	Bis-GMA* and TEGDMA*	Zirconia and silica – 84.5% - 0.6 μm
Filtek Supreme	Adper Single Bond2	Bis-GMA, Bis-EMA (6), UDMA and TEGDMA	Zirconia and silica - 78.5% - Nanofillers (5–20 nm) and Clusters (0.6 to 1.4 μm)
Filtek Silorane	Silorane System Adhesive	Silorane (3,4-epoxy cyclohexylethyl siloxane, bis-3,4- epoxy cyclohexylethyl phenylmethyl silane)	Quartz and yttrium – 76% - 0.47 μm

*Bis-GMA: bisphenol glycidyl methacrylate, TEGDMA: triethyleneglycol dimethacrylate, UDMA: urethane dimethacrylate, Bis-EMA: bisphenol ethoxylate dimethacrylate. Bis-EMA (6) is analogous to Bis-GMA; however, the former has six ethylene oxide units substituting the two hydroxyl groups between the aromatic backbone and the insaturates.