Substrate | SBMP | SB | CLSE | SBU | Positive control | Negative control |
---|
SE | ER |
---|
Enamel
| 19.0b (±10.2) | 26.6a (±9.3) | 26.0a (±8.5) | 23.5ab (±8.4) | 22.6ab (±9.9) | | |
Porcelain
| | | | | 29.0a (±6.9) | 21.0b (±7.0) | 5.3c (±2.7) |
- SBMP: Scotchbond Multipurpose; SB: Single Bond 2; CLSE: Clearfil SE Bond; SBU: Scotchbond Universal; SE: self-etch technique; ER: etch-and-rinse technique; Positive control: Silane plus SB; Negative control: no material.
- Distinct letters in the same row indicate statistically significant differences (p < 0.05).