Substrate
|
SBMP
|
SB
|
CLSE
|
SBU
|
Positive control
|
Negative control
|
---|
SE
|
ER
|
---|
Dentin
|
35.4ab (±10.5)
|
39.4a (±11.2)
|
36.6ab (±10.9)
|
28.1b (±13.7)
|
26.9b (±7.4)
| | |
Resin composite
| | | | |
28.4a (±9.9)
|
29.5a (±11.7)
|
12.1b (±8.7)
|
- SBMP: Scotchbond Multipurpose; SB: Single Bond 2; CLSE: Clearfil SE Bond; SBU: Single Bond Universal; SE: self-etch technique; ER: etch-and-rinse technique; Positive control: Silane plus SB; Negative control: no treatment.
- Distinct letters in the same row indicate statistically significant differences (p < 0.05).