Substrate | SBMP | SB | CLSE | SBU | Positive control | Negative control |
---|
SE | ER |
---|
Dentin
| 35.4ab (±10.5) | 39.4a (±11.2) | 36.6ab (±10.9) | 28.1b (±13.7) | 26.9b (±7.4) | | |
Resin composite
| | | | | 28.4a (±9.9) | 29.5a (±11.7) | 12.1b (±8.7) |
- SBMP: Scotchbond Multipurpose; SB: Single Bond 2; CLSE: Clearfil SE Bond; SBU: Single Bond Universal; SE: self-etch technique; ER: etch-and-rinse technique; Positive control: Silane plus SB; Negative control: no treatment.
- Distinct letters in the same row indicate statistically significant differences (p < 0.05).