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Applied Adhesion Science

Table 2 XPS measurements on the solder mask surfaces of different solder mask types in the SM-BM and SM-Cu configurations

From: Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion

Solder mask type

Configuration

C/at%

O/at%

Si/at%

N/at%

A

SM-BM

64.8

30.0

3.1

1.8

SM-C

66.8

28.0

2.9

1.6

B

SM-BM

65.8

29.0

3.4

1.3

SM-C

67.4

27.0

3.2

1.6

  1. Atomic percentages are displayed for the elements carbon, oxygen, silicon and nitrogen
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