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Table 2 XPS measurements on the solder mask surfaces of different solder mask types in the SM-BM and SM-Cu configurations

From: Influence of copper layer on epoxy acrylate based solder mask surface chemistry and the effect on epoxy adhesion

Solder mask type Configuration C/at% O/at% Si/at% N/at%
A SM-BM 64.8 30.0 3.1 1.8
SM-C 66.8 28.0 2.9 1.6
B SM-BM 65.8 29.0 3.4 1.3
SM-C 67.4 27.0 3.2 1.6
  1. Atomic percentages are displayed for the elements carbon, oxygen, silicon and nitrogen