Skip to main content

Table 2 Bond strength of metal-resin specimens with or without epoxy monolith mediator

From: Metal-resin bonding mediated by epoxy monolith layer

Resin Bond strength based on apparent adhesion area (100 mm2) (MPa) Imaginary bond strength based on pore cross-section area (MPa) Breaking strain for SUS-resin specimen (%) Modulus for SUS-resin specimen (GPa) Modulus for resin plates (GPa)
Via epoxy monolith Via flat epoxy Direct bonding
PE 2.00 ± 0.22 ~0 0.63 ± 0.21 28.2 ± 5.5 2.3 ± 0.6 0.4 ± 0.1 0.7
PEa 2.20 ± 0.31 ~0 0.63 ± 0.21 1.6 ± 0.5 0.4 ± 0.02 0.7
PP 1.36 ± 0.20 ~0 0.85 12.6 ± 3.4 1.2 ± 0.4 0.4 ± 0.1 0.9
POM 1.22 ± 0.57 ~0 0.52 17.0 ± 6.4 0.9 ± 0.4 0.8 ± 0.3 1.3
ABS 2.66 ± 0.74 ~0 0.08 35.3 ± 20.6 1.4 ± 0.5 0.8 ± 0.1 1.0
  1. a Epoxy with a connected-globule structure was used instead of epoxy monolith with a bicontinuous structure