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Table 1 Cure temperature of particular adhesive generally used for aerospace application

From: Bonded repair of composite structures in aerospace application: a review on environmental issues

  Adhesive Cure temperature
Epoxy film Epoxy Resin Hysol EA9390 [34] Curing at 95 °C for 4 h
Aradite AV119 [50] Cured at 120 °C for 2 h
FM 300K.05 film adhesive [3] Cured at 170 °C for 90 min
Epoxy film AF126 [47] Cured at 90 °C for 30 min and 120 °C for 120 min
Hysol EA 9359.3 [57] Curing at 82 °C for 1 h
Epoxy film adhesive FM355 [63] Curing at 177 °C for 1 h
Araldite 2015 [68] Cure at 24 h at R.T and Post-cure for 1 h at 80 °C
Adhesive FM 300-2M [68] For 1 h at 120 °C
Epoxy film FM 73 [47] Cured at 120 °C for 60 min
Epoxy Paste 3 M Scotch-Weld paste adhesive 9323 B/A [69] Cure 2 h at 65 °C or 15 days at 23 °C
XN1244 paste epoxy [70, 71] Cured at 140 °C for 1 h
Epoxypaste ESP110 [47] Cured at 150 °C for 45 min
Epoxypaste SI721Pl [47] Cured at 127 °C for 30 min
Airldite 2014 epoxy paste adhesive [66] 28 days curing at R.T or 4 h at 64 °C
Paste adhesive LME 10049-4/LMB 6687-2 [67] Dual step curing
Step 1 cured between 80 °C and 160 °C for 5–20 min
Step 2 cured between 140 °C and 180 °C for 5–20 min
Modified epoxy film adhesive BSL319 [4] Cure temp 170 °C
BSL312/5 [4] Cure temp 120 °C
Silicone RTV 106 silicone [70, 72] Curing at room temperature for 7 days
Bismaleimide Redux 326 [57] Curing at 175 °C for 2 h, postcuring at 230 °C for 2 h
Polyamide film adhesive Cytec’s oxyamide film adhesive FM32 [63] Curing at 177 °C for 4 h
American Cyanamid FM 1000 epoxide [73] Cured at 170 °C for 120 min