Table 1 Cure temperature of particular adhesive generally used for aerospace application

Epoxy film

Epoxy Resin Hysol EA9390 [34]

Curing at 95 °C for 4 h

Aradite AV119 [50]

Cured at 120 °C for 2 h

FM 300K.05 film adhesive [3]

Cured at 170 °C for 90 min

Epoxy film AF126 [47]

Cured at 90 °C for 30 min and 120 °C for 120 min

Hysol EA 9359.3 [57]

Curing at 82 °C for 1 h

Epoxy film adhesive FM355 [63]

Curing at 177 °C for 1 h

Araldite 2015 [68]

Cure at 24 h at R.T and Post-cure for 1 h at 80 °C

Adhesive FM 300-2M [68]

For 1 h at 120 °C

Epoxy film FM 73 [47]

Cured at 120 °C for 60 min

Epoxy Paste

3 M Scotch-Weld paste adhesive 9323 B/A [69]

Cure 2 h at 65 °C or 15 days at 23 °C

XN1244 paste epoxy [70, 71]

Cured at 140 °C for 1 h

Epoxypaste ESP110 [47]

Cured at 150 °C for 45 min

Epoxypaste SI721Pl [47]

Cured at 127 °C for 30 min

Airldite 2014 epoxy paste adhesive [66]

28 days curing at R.T or 4 h at 64 °C

Paste adhesive LME 10049-4/LMB 6687-2 [67]

Dual step curing

Step 1 cured between 80 °C and 160 °C for 5–20 min

Step 2 cured between 140 °C and 180 °C for 5–20 min

Modified epoxy film adhesive

BSL319 [4]

Cure temp 170 °C

BSL312/5 [4]

Cure temp 120 °C

Silicone

RTV 106 silicone [70, 72]

Curing at room temperature for 7 days

Bismaleimide

Redux 326 [57]

Curing at 175 °C for 2 h, postcuring at 230 °C for 2 h

Polyamide film adhesive

Cytec’s oxyamide film adhesive FM32 [63]

Curing at 177 °C for 4 h

American Cyanamid FM 1000 epoxide [73]

Cured at 170 °C for 120 min