Control of adhesive strength of acrylate polymers containing 1-isobutoxyethyl and isobornyl esters in response to dual stimuli for dismantlable adhesion
© The Author(s) 2017
Received: 27 August 2016
Accepted: 28 January 2017
Published: 6 February 2017
To develop an adhesion system satisfying both constant adhesion strength during use and quick debonding ability during a dismantling process.
Adhesive properties were investigated for the random and block copolymers consisting of 1-isobutoxyethyl acrylate (iBEA), 2-ethylhexyl acrylate (2EHA), and 2-hydroxyethyl acrylate (HEA) as the dismantlable pressure-sensitive adhesives in the presence of a photoacid generator in response to dual external stimuli of photoirradiation and post baking.
The use of LED combined with a new photoacid generator SIN-11 was enable us to achieve a rapid dismantling process during UV irradiation within several minutes. The protection of the ester alkyl group in the iBEA repeating unit to give an acrylic acid unit was suppressed by the introduction of isobornyl acrylate (IBoA) as the additional unit into the copolymer of iBEA, 2EHA, and HEA. While IBoA‐containing block copolymer showed a constant adhesive strength during photoirradiation as the single external stimulus, deprotection was immediately induced by the subsequent heating, leading to a significant decrease in the adhesive strength.
The copolymer including the iBEA and IBoA units was revealed to function as the highly sensitive adhesive materials for dual-locked dismantlable adhesion.
Dismantlable adhesion systems are smart technology and materials, which satisfy both a sufficient bonding strength during use and a quick debonding process on demand. They have attracted attention because of saving materials and energy in various application fields, such as housing, electronics, medical and dental applications as well as manufacturing processing for industrial parts and machines [1, 2]. For the design of dismantlable adhesive materials, the adhesive property needs to instantaneously change in response to any external stimulus as a trigger for dismantling, for example, heating, UV irradiation, induction heating, electricity, and chemicals [3–15]. A change in the chemical structures of the adhesives by external stimuli was expected to induce a significant change in the adhesive properties. We previously reported a dismantlable adhesive system using degradable polyperoxides as curable and pressure-sensitive adhesives and the control of bonding strength by the radical chain degradation of the polyperoxide adhesives [16–18]. More recently, we developed an advanced system using acrylic polymers containing t-butyl acrylate (tBA) unit in order to overcome the dilemma of reliable adhesion property during use and the subsequent quick debonding [19–24]. The tBA-containing polymers were demonstrated to function as the dismantlable adhesive materials due to a facile transformation to polymers including acrylic acid repeating units, accompanied by the elimination of isobutene gas, under the appropriate photo irradiation conditions followed by postbaking at a desired temperature. It was previously revealed that the tBA-containing block copolymers showed excellent dismantling properties compared with the corresponding random copolymers [19, 22]. The validity of the dual-locked adhesion system in the presence of a photoacid generator (PAG) was also reported. In this system, an acid was formed by the photoreaction of PAG, and then chemically amplified deprotection proceeded during postbaking, in which a large number of repeated chemical reactions were induced by a single photochemical event, resulting in the efficient transformation of protected functional groups.
In order to develop adhesives more sensitive to external stimuli, we investigated the dismantlable adhesion behavior of the acrylic copolymers consisting of 1-isobutoxyethyl acrylate (iBEA), 2-ethylhexyl acrylate (2EHA), and 2-hydroxyethyl acrylate (HEA) units . Reactive polymers with functional groups protected with vinyl ethers have been synthesized and used for various applications, as reported in the literatures [26–31]. We found that the polymers containing the iBEA units were readily deprotected under single-stimulus conditions, such as hydrolysis without an acidic catalyst or acidolysis at room temperature under photoirradiation in the presence of PAG . The use of the iBEA repeating unit as the reactive groups was suited to the construction of a quick debonding system, but the iBEA-containing copolymers were too reactive against the external stimuli such as heating in water and photoirradiation in the presence of PAG and consequently they were not applied as the dual-locked adhesive polymers. Previously, we reported that the deprotection conditions significantly depended on the stability of the ester groups of the adhesive polymers . For example, the deprotection of the isobornyl ester proceeded under the conditions at a higher temperature for a longer reaction time in the presence of a larger amount of PAG. In this study, we investigated the dismantlable adhesion properties of the acrylic copolymers including an isobornyl acrylate (IBoA) unit in order to modify the responsibility of the iBEA-containing copolymers during a debonding process under the photoirradiation and subsequent heating conditions. We examined the dismantling properties of the random and block copolymers containing the iBEA, 2EHA, and HEA repeating units in the presence or absence of the additional IBoA repeating unit.
The 1H NMR spectra were recorded on a JEOL ECX-400 spectrometer using chloroform-d at room temperature. The number- and weight-average molecular weights (M n and M w) were determined by size exclusion chromatography (SEC) in tetrahydrofuran as the eluent at 40 °C using JASCO PU-2086 Plus equipped with UV-2075 Plus and 830-RIS detectors and Shodex A-800P columns. The molecular weights were calibrated with standard polystyrenes. The thermogravimetric (TG) and differential scanning calorimetry (DSC) were performed using Shimadzu DTG-60 and DSC-60, respectively, at a heating rate of 10 °C/min in a nitrogen stream. The 180° peel test was performed using a Shimadzu universal testing machine AGS-X with a 1 kN load cell according to ASTM D3330 at room temperature and a peel rate of 30 mm/min.
2EHA (Nacalai Tesque, Inc., Japan), HEA (Nacalai Tesque, Inc., Japan), and IBoA (Tokyo Chemical Industry Co., Ltd., Japan) were distilled under reduced pressure before use. 2,2′-Azobis(isobutyronitrile) (AIBN) and 2,2′-azobis(4-methoxy-2,4-dimethylvaleronitrile) (AMVN) were purchased from Wako Pure Chemicals Co., Ltd., Japan and recrystallized from methanol. Acrylic acid (Nacalai Tesque, Inc., Japan), isobutyl vinyl ether (Tokyo Chemical Industry Co., Ltd., Japan), 10-campharsulfonic acid (Tokyo Chemical Industry Co., Ltd., Japan), and diphenylditelluride (DPDT, Tokyo Chemical Industry Co., Ltd., Japan) were used as received. Other reagents and solvents were used without further purification. iBEA was synthesized according to the method described in the literature . All copolymers were synthesized by organotellurium mediated radical polymerization (TERP) using binary azo initiators [20, 32]. SIN-11 [33–35] was supplied from Sanbo Chemical Industry, Ltd., Sakai, Japan, and used as received.
Synthesis of iBEA
To acrylic acid (17.98 g) and 10-campharsulfonic acid (6.0 mg) in 100 mL of n-hexane, isobutyl vinyl ether (25.28 g) was dropwise added at 0 °C under an argon atmosphere with stirring. After the addition, the stirring of a reaction mixture was maintained at room temperature for 3 h. Added was a small amount of calcium hydroxide then stirred for 30 min. After filtration, the solvent was removed under reduced pressure. The obtained crude product was distilled under reduced pressure. The pure iBEA was obtained in 97% yield.
Liquid; 1H NMR (300 MHz, CDCl3) δ 6.36 (dd, J = 17.4 and 1.5 Hz, CH 2=CH (trans), 1H), 6.05 (dd, J = 17.4 and 10.5 Hz, CH2=CH, 1H), 5.92 (q, J = 5.4 Hz, OCH(CH3), 1H), 5.78 (dd, J = 10.5 and 1.5 Hz, CH 2=CH (trans), 1H), 3.39 − 3.16 (m, OCH2, 2H), 1.84-1.71 (m, CH2CH(CH3)2, 1H), 1.19 (d, J = 5.4 Hz, OCH(CH 3), 3H), 0.82 (d, J = 6.6 Hz, CH(CH 3)2, 6H).
Synthesis of copolymers
Synthesis of block copolymers by TERP
Conversion of iBEA/IBoA (%)
M w/M n
Conversion of iBEA/IBoA/2EHA/HEAb (%)
A SUS430 (150 × 50 × 0.5 mm3) plate was cleaned by ultrasonication in acetone for 15 min, then in 2-propanol for 15 min. The 15 wt% acetone solution of the polymer was applied on a poly(ethylene terephthalate) (PET) film (50 mm thickness) by a film applicator (200 μm gap). The film was dried in vacuo for 12 h in the dark, and then cut to a 20-mm wide. The film was pressure bonded on a SUS plate using a 2-kg hand roller. After UV irradiation (and the subsequent heating if needed), the 180º peel test was carried out after the specimen was left to stand for over 30 min at room temperature.
UV irradiation was carried out using an LED lamp HLDL-50UV365-FN (365 nm, CCS Inc., Japan) at room temperature. For the UV irradiation, the test piece was placed at a distance in a range of 5.9–14.5 cm from the LED lamp. For the thermal treatment after the UV irradiation, the test piece was placed in a preheated oven for a determined time.
Results and discussions
Composition and property of random and block copolymers used in this study
Composition in the copolymers (mol%)
IBoA content in the reactive segmenta (mol%)
M w/M n
T g (°C)
The T g values of the homopolymers of iBEA, HEA, and IBoA were reported to be −10, −15, and 94 °C, respectively, being much higher than that of the homopolymer of 2EHA (−85 °C) [19, 25]. The T g value was determined to be −19 °C for the random copolymer R1, which consisted of 2EHA unit (53 mol%) as the low T g repeating unit and iBEA (32 mol%) and HEA (15 mol%) units as the moderate T g repeating units. Because the introduction of IBoA into the copolymer increased the T g values of the copolymers, we carefully controlled the copolymer compositions in order to exhibit similar T g values for the copolymers with and without the IBoA unit. For the block copolymers synthesized in this study, the reactive segments showed the constant T g values at −18 °C due to the small contribution of the IBoA unit introduced with an only 5 mol% into the reactive segment, as is shown in Table 2. The T g values of the random copolymer R1 and the hard segment of the block copolymer B1 containing no IBoA unit were similar to each other. The effect of the M n values (14.1 × 104 and 8.8 × 104 for R1 and B1, respectively) should be considered to discuss the T g values of these copolymers. As a result, we successfully prepared three types copolymers containing a segment with T g value. The adhesive segments consisting of 2HEA as the major component exhibited T g values lower than −50 °C for the block copolymers. These T g values were enough for the use as the pressure-sensitive adhesive materials. In this study, the adhesive segment including the mainly 2EHA units was produced during the second-step block copolymerization without isolation of the prepolymers produced during the first-step polymerization of iBEA or a mixture of iBEA and IBoA (See Fig. 1 for the accurate sequence structures of the block copolymers). Therefore, the second adhesive sequences produced during the second-step polymerization were confirmed to include not only the 2EHA and HEA repeating units but also small amounts of iBEA and IBoA repeating units as a result of the participation of the residual monomers after the first-step polymerization. The observation of two T g values for the block copolymers (B1 and B2) undoubtedly indicated the microphase separation structure of the reactive segment produced during the first-step polymerization and the adhesive segment produced during the second-step polymerization.
Change in peel strength of random and block copolymers during photo irradiation using LED lamp
Post baking conditions
Peel strength (N/20 mm)
2.65 ± 0.12
0.035 ± 0.012
SUS interface and cohesive (9/1)
3.06 ± 0.06
0.42 ± 0.11
0.042 ± 0.034
0.010 ± 0.003
SUS and PET interfaces (5/5)
0.0011 ± 0.00056
SUS and PET interfaces (8/2)
3.80 ± 1.27
3.85 ± 0.06
SUS interface and cohesive (5/5)
2.07 ± 0.16
SUS and PET interfaces (4/6)
0.04 ± 0.008
SUS and PET interfaces (9/1)
0.11 ± 0.01
3 min/100 °C
0.079 ± 0.001
3 min/100 °C
0.057 ± 0.06
It was also found that the failure mode diversely changed depending on the photoirradiation conditions, as shown in Table 3. For the failure mode of the copolymers with different sequence structures, i.e., R1 and B1, the mode for the both copolymers changed depending on the photoirradiation dose as follows: cohesive failure, failure at the PET/adhesive interface, and then failure at the SUS/adhesive and PET/adhesive interfaces. In the case of R1, the failure occurred at the PET interface due to the considerably high cohesive force rather than the PET/adhesive interface interaction. The high molecular weight of R1 was favorable for increasing the cohesive interaction. The cohesive force further increased along with the photoirradiation because of the formation of polar and functional groups as well as the occurrence of cross-linking. The interactions at the SUS/adhesive and PET/adhesive interfaces competed with each other and determined the failure mode, but the both interactions seemed to be weak and finally the isolation of the adhesive layers was often observed. In fact, it was considered that the transesterification and/or esterification of the HEA unit took place with the deprotection of the iBEA unit in the presence of an acid catalyst causing cross-linking . In the previous study, the adhesive layer stuck on the PET film was easily peeled off and consequently the cross-linked adhesive layer was removed from both the SUS and PET without any adhesive deposit . The cross-linking caused by the reactions of the HEA units temporarily increased the modulus of the adhesives. In this study, the SUS or PET interface failure observed after dismantling was accounted for by similar cross-linking and transesterification reactions. The heating process for the dismantling using dual external stimuli led to the interfacial failure between the PET and adhesives because of an increase in the interaction between the SUS surface and the adhesives containing a carboxylic acid. However, it was hard to fully explain the all failure modes of B2 including hydrophobic IBoA, hydrophilic HEA, and reactive iBEA units as well as adhesive 2EHA unit under various irradiation and heating conditions for dismantling, because they kaleidoscopically changed according to the dismantling conditions.
We synthesized the random and block copolymers consisting of iBEA, 2HEA, and HEA repeating units in the absence and presence of IBoA by the TERP method as the living radical polymerization technique, which was valid for the synthesis of high-molecular-weight acrylate polymers including polar and functional groups in the side chain. The adhesion property of the obtained iBEA copolymers were investigated as the dismantlable adhesives responsible to photoirradiation and heating. It was demonstrated that the use of LED combined with a new photoacid generator SIN-11 was enable us to achieve a rapid dismantling process during UV irradiation within several minutes. The introduction of the IBoA unit into the copolymer resulted in the enhanced resistance to photoirradiation, while the subsequent heating at 100 °C for 3 min immediately led to a significant decrease in the adhesion strength. Thus, the copolymer including the iBEA and IBoA units was revealed to successfully function as the highly sensitive adhesive materials for dual-locked dismantlable adhesion.
AM and ES designed the study and prepared the manuscript. YF carried out the experiments for polymer synthesis and measurements. HO and HH designed a photo acid generator and the related experiments. All authors read and approved the final manuscript.
The authors declare that they have no competing interests.
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